Table of Contents:

Departments

• Letter From the Editor
  
• Guidelines for EEELinks Article Submission
  
• Upcoming Events
  
• Up Close With Hasso Niemann

Introduction

• NASA Extreme Environment Parts and Packaging Applications and Reliability Issues

• NEPP Parts and Packaging Cold Temperature Electronics Task Team Report and Their Findings
  
  
• Cryogenic Evaluation of an Advanced DC/DC Converter Module For Deep Space Applications
  
  
• Evaluation of Voltage Reference Circuits and N-Channel Field Effect Transistors at Low Temperatures
  

(Low and High Temperature Testing)

• Evaluation of Data Retention and Imprint Characteristics of FRAMs Under Environmental Stresses for NASA Applications
  
  
• Reliability Evaluation of Thermally Actuated Micromachined Relays for Space Applications
  
  
• Effects of Extreme Temperature on Characteristics of Voltage Reference Microcircuits
  Encapsulated in Plastics
  
  
• Evaluation of COTS Dual-Axis MEMS Accelerometers Before and After Extreme Temperature Thermal Cycling (-125 °C to 90 °C)
  
  
• Assessment of Flip-Chip Advanced Test Assembly Electronics Packages Under Extreme Temperature Applications

(Very High Temperature
SiC Based Packaging)

• High Temperature Electronics: A Role for Wide Bandgap Semiconductors?
  
  
• Microsystem Packaging for High Temperature Environments

(General Reports)

• Characterizing Space-Flight Inductors and Transformer Failures

(back to cover)

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