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Extreme
Temperature (-125°C to +90°C)
Thermal Cycling of UC282, LT1813, and LTC1409
Rajeshuni
Ramesham, Ph.D.
Jet Propulsion Laboratory
Objective
The objective of this test is to evaluate the package of UC282 (5
pin package, TO/SOT; Fast Transient Response 3 Ampere Low Dropout
(LDO) Regulator), LT1813 (Dual Operational Amplifier, 8-pin SO)
and LTC1409 (12 bit, 800ksps sampling A/D Converter, 28-Lead Plastic
SSOP) via thermal cycling tests and inspection by optical microscopy.
Introduction
The products of UC282, LT1813, and LTC1409 have been proposed for
use in the control electronics package of Panoramic Camera Project
for Mars Exploration Rover (Cog E: Mark Schwochert, MER). The Jet
Propulsion Laboratory (JPL) Parts Group has undertaken an effort
to upscreen the parts required to build such a package board for
Panoramic Camera electronics. In addition to these, there were several
other parts in the complete package board. There are several steps
involved in upscreening the parts for any NASA project. Thermal
cycling is one of the steps in upscreening the parts to meet the
project specific operational environment.
UC282 (Ref.:
Web site of Texas Instruments): Fast Transient Response 10-mA
to 3-A Load Current, Short Circuit Protection, Maximum Dropout of
450-mV at 3-A Load Current, Separate Bias and VIN Pins, Available
in Adjustable or Fixed-Output Voltages, 5-Pin Package Allows Kelvin
Sensing of Load Voltage, Reverse Current Protection. The maximum
storage temperature is 65°C to +150°C.
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| Figure
1: Optical photographs of the UC282 before thermal cycling |
LT1813 (Ref.:
Web site of Linear Technology): This is dual and quad, low power,
high speed, very high slew rate operational amplifier with excellent
DC performance. Other characteristics are 100MHz Gain Bandwidth
Product, 750V/µs Slew Rate, 3.6mA Maximum Supply Current per
Amplifier, 8nV/rtHz Input Noise Voltage, Unity-Gain Stable, 1.5mV
Maximum Input Offset Voltage, 4µA Maximum Input Bias Current,
400nA Maximum Input Offset Current, 40mA Minimum Output Current,
VOUT = ±3V, ±3.5V Minimum Input CMR, VS = ±5V,
Specified at ±5V, Single 5V Supplies, Available in MS8 and
SO-8 Packages. The applications of this device are Wideband Amplifiers
Buffers, Active Filters, Video Amplification, Cable Drivers, Data
Acquisition Systems, Communication Receivers. The maximum operating
temperature range is 40°C to +85°C.
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| Figure
2: Optical photographs of the LT1813 before thermal cycling |
LTC1409
(Ref.: Web site of Linear Technology): The LTC 1409 is 1 m s,
800ksps, sampling 12-bit A/D converter that draws only 80 mW from
± 5 V supplies. Sample Rate: 800ksps, Power Dissipation:
80mW, 72.5dB S/(N + D) and 86dB THD at Nyquist, No Pipeline Delay,
Nap (4mW) and Sleep (10µW) Shutdown Modes. Operates with Internal
15ppm/°C Reference or External Reference, True Differential
Inputs Reject Common, Mode Noise, 20MHz Full Power Bandwidth Sampling,
±2.5V Bipolar Input Range, 28-Pin SO Wide and SSOP Package.
The applications for this device are Telecommunications, Digital
Signal Processing, Multiplexed Data Acquisition Systems, High Speed
Data Acquisition, Spectrum Analysis, and Imaging Systems. The maximum
operating temperature range is 0 to +70°C.
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3: Optical photographs of the LTC1409 before thermal cycling
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Test Objective
Based on the technical features of the devices listed above the,
manufacturer specified, maximum operating temperature varies from
55°C to +90°C. However, these parts have been proposed
for usage in the Camera Electronics boards for MER with an operating
environment of 125°C to +90°C. Therefore, an assessment
of the package reliability is necessary for usage in such an extreme
low temperature environment.
Thermal
Cycling Tests
The following measurements were taken before thermal cycling.
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| Figure
4: Actual thermal cycling (10 cycle) profile |
Summary
UC282, LT1813,
and LTC1409 were subjected to ten thermal cycles in the range of
125°C to +90°C. This temperature range is appropriate
for a package where no thermal control was provided in a subsystem
of the project such as MER. No cracks or damage was observed in
the packages after ten thermal cycles in an extreme low temperature
range. Surface analytical techniques may be used in the future to
characterize the surface of the leads before and after thermal cycling
to learn more about the surface characteristics. X-ray and C-SAM
may be used before and after thermal cycling in such extreme temperature
range to learn more on the interior condition of packages that are
being inspected using optical microscopy which is good only for
external features.
Acknowledgements:
Thanks are due to Shri Agarval, Mike Sander, Kevin Robinson, Larry
Elias, for their timely help prior, during, and after thermal cycling
test. Thanks are due to the MER project for supporting this testing
and also the NEPP project task for assessing the reliability of
robustness of the respective package.
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