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Fiscal
Year 2002 NEPP Tasks
NEPP is extremely
busy preparing for the upcoming year, FY02. Below is a list of some
of the many tasks that the NEPP Program will be working on, categorized
by Project.
ELECTRONIC
PARTS - (EPAR)
- Choon Lee, Project Manager
Extreme
Environments
*GRC, Extreme Environment Electronics and Packaging, Patterson
Reliability
of Thin, Low/High K Dielectrics
*JPL, Advanced and Emerging Technologies, Petkov
Fibers,
Modulators (IPPAQ)
*GSFC, Advanced and Emerging Technologies, Ott
Long
Life Electronics
*JPL, Advanced and Emerging Technologies, Kim
MEMS
(MOEMS, RF) Reliability
*JPL, Advanced and Emerging Technologies, Wellman
Reliability
of RF Devices
*JPL, Advanced Interconnect Reliability, Leon
Optoelectronics
Reliability
*LaRc, Advanced Interconnect Reliability, Riggins
System-on-a-Chip,
ASIC Design for Reliability
*JPL, System on a chip (SOC) and System in a package (SIAP) Reliability,
Perret
SEMATECH
*JPL, Advanced and Emerging Technologies, Smith
Cu
Metallization Reliability
*JPL, Advanced Interconnect Reliability, Leon
FPGAs for
NASA Space Systems - Lee
-High
Density FPGA Qualification
*JPL, Development of Innovative Qualification Methods, Roosta
-Reliability
Evaluation of FPGAs for Space Applications
*GSFC, Advanced and Emerging Technologies, Katz
-Value
of Post Programming Burn-in
*GSFC, Advanced and Emerging Technologies, Katz
Reliability
of Laser Arrays
*LaRC,
Advanced Interconnect Reliability, Riggins
Enabling
Insertion of COTS in NASA Systems - Shaw
-PEMs
Qualification Methods, Necessity for Upscreening, Guideline Support
*GSFC,
Advanced and Emerging Technologies, Sharma
ELECTRONIC
PACKAGING (EPAC) - Phil Zulueta, Project Manager
Enabling
Reliability Through Board-Level Qualification - Zulueta
-Chip-on-Board
Reliability
*JPL, Advanced Interconnect Methods, Bolin
-Reliable
Board Level Screening Methods
*GSFC, Development of Innovative Qualification Methods, Shaw
-Reworkable
Underfill Characterization
*JPL, Advanced Interconnect Methods, Ghaffarian
-Embedded
Passive Devices Technology
*JPL, Substrates and Embedded Packaging Technologies, Gerke
-Reliability
Assessment of Board Microvias for Spaceborne Electronics
*
JPL,
Substrates and Embedded Packaging Technologies, Mih
Enabling
Insertion of COTS in NASA Systems - Zulueta
-COTS
MEMS Sensors/Accelerometers Quality & Reliability Characterization
*JPL, COTS, MEMS/MOEMs, Reliability and
Assurance;
Ghaffarian
- Reliability
of COTS PEMs
*GSFC, Newly Available Technologies and COTS, Sharma
MOEMS
Interconnect Reliability
*JPL, MEMS/MOEMS Reliability and Assurance, Ghaffarian
Packaging
and Reliability Assessment of Electronic Noses
*JPL,
Advanced
Sensors, Ramesham
Interconnect
Reliability of Cold Electronics
*JPL, Extreme Environments, Ramesham
Packaging
for High Temperature SiC Based Electronics and MEMS Pressure Sensors
*GRC, Extreme Environments, Chen
Characterization
of Optical Fiber Cables for Space Flight
*GSFC, Photonic Systems and Devices, Ott
Packaging
Evaluation of High Power Laser Diode Arrays
*LaRC, Photonic Systems and Devices, McGee
IPPAQ
- System-in-a-Package/System-on-a-Chip Technologies
*JPL, Development of Innovative Qualification Methods, Ghaffarian
Reliability
of NASA Langley Research Center Macro-Fiber Composite (LaRC-MFC)
Actuators
*LaRC, Advanced Sensors, Bockman
ELECTRONIC
RADIATION CHARACTERIZATION (ERC) - Ken LaBel, Project
Manager
Enabling
Insertion of COTS in NASA Systems - LaBel
-Extension
of Flight Project Tests
*GSFC, Newly Available Technologies and COTS, Howard
-Radiation Hardness Assurance for Linear Devices
*JPL, Radiation Hardness Assurance, Pritchard/Poivey
-Radiation
Characterization, Test Techniques, Guidelines for COTS
*JPL, Radiation Hardness Assurance, Scheick/Ladbury
-Development
of Improved Radiation Qualification Methods
*JPL, Development of Innovative Qualification Methods, McClure/Ladbury
Radiation
Websites
*JPL, Radiation Hardness Assurance, McClure/Ladbury
High
Energy Fac - IPPAQ
*GSFC, Advanced and Emerging Technologies, Reed
Radiation
Test of SiGe High Speed Devices
*GSFC, Advanced and Emerging Technologies, Reed
Assessment
of Sensor Tech
*GSFC, Advanced Sensors/Detectors, Marshall
Emerging
Photonic Devices and Data Links
*GSFC, Photonic Systems and Devices, Marshall/Johnston
Flight Data
and Anomaly Analysis
*GSFC, Advanced and Emerging Technologies, Poivey/Pritchard
Radiation
Test Guidelines for Optocoupler
*GSFC, Photonic Systems and Devices, Johnston/Reed
Emerging
CMOS Microelectronics
*JPL, Advanced and Emerging Technologies, Patterson/Xapsos
Rad
Qualification for Extreme Environments
*JPL, Extreme Environment Electronics and Packaging, Irom
Radiation
Effects in New Device Dielectrics
*JPL, Advanced and Emerging Technologies, Scheick
Characterization
of Ultracapacitors
*JSC, Radiation Hardness Assurance, Beverly/Scheick
Terrestrial
Radiation Effects
*JPL, Radiation Hardness Assurance, Johnston
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Fiscal Year 2002 NEPP Tasks