RP technology includes several distinct processes used to create a solid 3D model. In brief, the most popular RP processes include selective laser curing of photopolymer (Stereo Lithography), precise jetting deposition of thermoplastic, selective laser sintering of polymers and metals, and lamination using foils and adhesives. In all but the precise jetting process lasers are relied upon to either excise or cure the model material.

The primary benefit of the RP technology is that a solid model can be built very quickly and inexpensively once a CAD file has been generated. This allows designers to build prototypes as frequently as desired during the design process. The Code Q funded activity is focused on defining and model developing product assurance processes that can be applied to these models as early in the design cycle as possible.

The most recent advancements in the RP field have been involved with using the RP workcells for manufacturing tools, molds and direct metal parts. Several of the RP technologies will allow you to model preforms which can be used for investment casting. This allows a substantial time savings (several weeks) in the design and creation of casting molds. The Selective Laser Sintering process allows you to directly model with metal powders (used with a polymer binder) which can then be infused with copper to yield near full density metal parts. Research in this area is accelerating and direct metal and composite manufacturing is a strong interest in the space community where production volumes are ultra-low.

The New Millennium Programís Mars Microprobe (DS 2) is currently being developed at JPL. The RP task is teamed with the DS 2 development and are working together to define and develop innovative applications for the RP models which will yield higher quality and more robust designs. To-date, several models of the Mars Microprobe have been built. Designers responsible for the electronic packaging development are using these models to perform trade-offs, develop manufacturing plans, inspection plans, identify critical interfaces and potential problems with the interfaces of the discreet assemblies.

Future work at JPL will be focused on furthering the application of RP model use for validation and verification processes which typically are applied to flight or engineering hardware. Teaming and collaborative efforts are being pursued with Northrop (B-2 Division), Rocketdyne, MSFC and JSC. Other interested parties should contact the author to discuss potential collaboration in the areas of validation and verification and advanced materials development for direct metal/composite manufacturing using RP technology.