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Additional Workmanship Standards Commonly Invoked by NASA |
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List of Industry Workmanship Standards Commonly Invoked by NASA
The following industry standards are regularly invoked at the NASA project level Copies of these can either be downloaded from the IPC website or from http://standards.nasa.gov.
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Doc# |
Title |
Revision Date |
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IPC-2221 |
Generic Standard on Printed Wiring Board Design |
2/1/98 |
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IPC-2222 |
Sectional Standard on Rigid Printed Wiring Board Design |
2/1/98 |
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IPC-2223A |
Sectional Design Standard for Flexible Printed Boards - Supersedes IPC-D-249 |
6/1/04 |
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IPC-2225 |
Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies |
5/1/98 |
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IPC-6011 |
Generic Performance Specifications for Printed Boards |
7/1/96 |
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IPC-6012A |
Qualification and Performance Specification for Rigid Printed Boards |
10/1/99 |
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IPC-6013A |
Qualification and Performance Specification for Flexible Printed Boards - Amendment 1: 1/2005 |
11/1/03 |
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IPC-6015 |
Qualification and Performance Specification for Organic Multichip Module (MCM-L) Mounting and Interconnecting Structures |
2/1/98 |
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IPC-6018A |
Microwave End Product Board Inspection and Test - HF-318B; Supersedes HF-318A December 1991 |
1/1/02 |
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J-STD-004 |
Requirements for Soldering Fluxes - Replaces QQ-S-571: 1994; Amendment 1 - April 1996 |
1/1/95 |
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J-STD-005 |
Requirements for Soldering Pastes; Amendment 1 - June 1996 |
1/1/95 |
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J-STD-006 |
Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications |
5/1/01 |
The following industry standards are under consideration for NASA-wide adoption. Copies and coordination meeting minutes downloaded from IPC.
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