Also on this page:
	Buswire Fracture from Nick in Lead
	Microcircuit ESD Damage
	Electrolytic Capacitor Leakage
	Conformal Coating Under Diode
	Excess Solder Wicking Into Sockets
	Damage from Incorrect Lead Forming
	Lead Damage From Bending Tool
	Lead Fracture from Inadequate Support

Parts and Components

Parts and Components

1. Buswire fracture due to nick in lead

2. C2 MOS capacitor ESD damage

3. Conformal coating under diode

4. Excess solder wicking up into sockets

5. Improper lead forming resulting in part damage

6. Lead damaged due to incorrect bending tool-process

7. Lead fracture due to inadequate mechanical support