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Category: PEMs Test Techniques
Document Title Abstract Author Upload Date
1 Analysis of Plastic Parts Package Delamination
02/24/06
2 High-Temperature Degradation of Wire Bonds in Plastic Encapsulated Microcircuits
06/20/05
3 Environmental Stress Testing of Power Transistors Encapsulated in Plastic Packages
11/23/04
4 PEMS Moisture Test Terminology Compared
11/01/04
5 PEMS CSAM Presentation JPL
11/01/04
6 PEMs Research
09/23/04
7 Moisture-related failures of operational amplifiers in plastic packages
08/16/04
8 Reliability Evaluation of Linear PEMs Rejected During C-SAM Examination (slides)
02/17/04
9 PEM-INST-001 Instructions for Plastic Encapsulated Microcircuit (PEM) Select, Screen, & Qualify
06/16/03
10 Recommended PEMs Packaging Test Flow & FIT Numbers used by Candidate Manufacturers 2003
02/18/03
11 A Rapid Technique for Moisture Diffusion Characterization of Molding Compounds in PEMs
10/15/02
12 Characteristic Times of Moisture Diffusion and Bake-out Conditions for Plastic Encapsulated Parts
10/15/02
13 Chlorine contamination diffusion in silicones
03/05/02
14 A Technique for Assessing the Moisture Resistance of PEMs Using MOS Test Structures
03/05/02
15 Test Flows for Space PEMs
02/28/02
16 DPA Guide for PEMs - Draft
02/22/02
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