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Category: PEMs Test Data
Document Title Abstract Author Upload Date
1 Results of Screening and Qualification Testing of COTS PEMs for Space Applications and Lessons Learn
02/14/05
2 NEPAG PEMS CSAM Data Review for Multiplexer
11/02/04
3 NEPAG PEMS CSAM Data Analysis for Multiplexer
11/02/04
4 NEPAG PEMS MSL & Moisture Qualification Results
11/01/04
5 NEPAG PEMS Packaging Evaluation Results
11/01/04
6 Glass Transition Temperature (Tg) Paper JPL
11/01/04
7 Glass Transition Temperature (Tg) Presentation JPL
11/01/04
8 PEMS Cold Tests Powerpoint Slides
11/01/04
9 Effect of Vacuum on High-Temperature Degradation of Au-Al Wire Bonds in PEMS
04/19/04
10 Effect of Vacuum on High Temperature Degredation of Gold/Aluminum Wire Bonds in PEMs
03/23/04
11 Package Qualification Testing Results Performed on the 5 Part Types in the NEPP/NEPAG PEMS Study
03/18/04
12 Lessons Learned from Screening and Qualification of COTS PEMs for Space Applications (slides)
02/17/04
13 Impact of Tg of Molding Compounds on Screening and Reliability Qual of PEMs for Space (paper)
11/12/03
14 In-situ Measurements of Thermo-Mechanical Characteristics of Molding Compounds in PEMs
09/02/03
15 Package induced instability in voltage reference PEMs (slides)
06/17/03
16 Environmental Hysteresis in Moulding Compounds and Volt Reference PEMs: White Paper
03/19/03
17 Effect of Extreme Temperature Cycling of PDIP-8 OP181 Op Amp
03/05/03
18 Environmental Hysteresis in Moulding Compounds and Volt Reference PEMs: Presentation
02/20/03
19 Moisture Characteristics of Molding Compound and Environmental Effects in PEMs (slides)
11/26/02
20 Environmentally Induced Swelling and Shrinkage of Molding Compounds in PEMs
10/15/02
21 EV72015_LT1014IS
02/22/02
22 EV61261_LT1014IS
02/22/02
23 EV78074_58V1001T25
02/22/02
24 Guidebook on the Use of PEMs at High Altitudes (slides)
11/06/01
25 Dynamic Stress Analysis of TSOP Devices with Different Chip Sizes
09/17/01
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