Non-NASA References
Site Map
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Introduction
This page provides access to documents and other content which reside outside of the nepp.nasa.gov web system. A distinction has been made between "NASA" and "non-NASA" information in order that researchers can be aware when the site is displaying or pointing to practices, findings, guidelines or positions developed by or for non-NASA entities, which may or may not have the same reliability concerns as NASA.
Other Links and References
Conferences
Commercialization of Military and Space Electronics Conference & Exhibition: International conference on the use of COTS in military and space electronics. Attendees are generally engineers and managers in the EEE parts and electronic systems area. Topics include: Design Practices, Applications, Case Studies/Histories, Obsolescence Management, Radiation Hardness, Technology Trends, Risk Mitigation, Selecting COTS and Commercial Suppliers, Testing Requirements and Results, Construction and Destructive Physical Analysis. Abstracts call is around mid summer. Conference is normally held in California (often in Los Angeles) in February.
DoD DMSMS Conference: Concerns issues related to sustaining weapons systems. This conference traditionally includes PEMS issues as well. The due date for abstracts is in mid-October and the conference is held in the spring. (with some deviation in the conference dates – the location changes every year).
IRPS, International Reliability Physics Symposium, sponsored by IEEE: addresses the physics of failure for semiconductor devices and packages. Topics include: introduction to reliability, product reliability, failure analysis, reliable plastic encapsulated microcircuits for harsh environments, dielectric reliability, and ESD failure mechanisms. The symposium is held in April, generally alternating between a west coast and an east coast location, with a call for papers in October.
ECTC, Electronic Component and Technology Conference, sponsored by IEEE: covers the state-of-the-art for packaging materials and techniques for power devices, RF devices, ICs, etc. Reliability testing and failure analysis papers are also presented. The conference is held in early June, generally alternating between a west coast and an east coast location, with a call for papers in October.
Industry, Academic and Government Standards Organizations and Colloquia
The private aerospace and electronics industries and the US government, through the DoD and civilian organization such as NASA and NIST, have worked together for decades to share findings about PEMs reliability. As a result, a large body of work and a number of active communities exist which address technical issues and concerns regarding PEMs manufacturing, testing and application. Though their findings or conclusions may not in all cases directly or wholly apply to a particular NASA program, they together reflect how industry is reacting to the needs of customers both at the part and the system levels. The links below will help NASA engineers who need more in-depth or historical information about PEMs technology and standards.
JEDEC (Joint Electron Device Engineering Council) is the semiconductor engineering standardization body of EIA. It covers the standardization of discrete semiconductor devices and integrated circuits, including package dimensions and test methods for non-hermetic packages. The subcommittee responsible for PEMs is JC 11.11. JEDEC is a member organization which sells its standards documentation, therefore access to information on this website is limited without a user account.
TIA (Telecommunication Industry Association) is an industry organization representing providers of communications and technology products and services; in particular, working group FO-4.4 is concerned with the reliability testing and requirements of fiber optic amplifier systems and active optical components. Much of the work of this group addresses the assessment of plastic encapsulated or non-hermetic optical components.
GEIA (Government Electronics Industries Association) The GEIA promotes the interests of the U.S. electronics, communications and information technology industries with regard to government markets, requirements, and technical standards. GEIA is a member-based organization and sells the standards and specifications its member committee produce. The subcommittee that works on PEMs issues in under the G12: Solid State Devices Subcommittee (use: G12, EIA5962) and is called the PEMs Subcommittee. An oft-referenced work produced by this subcommittee is SSB1: Guidelines for Using Plastic Encapsulated Microcircuits and Semiconductors in Military, Aerospace and other Rugged Applications, which can be found in the NEPP collection (click on Guidelines - NEPP Collection on the main Portal page).
CALCE: The Computer Aided Life Cycle Engineering (CALCE) Electronic Products and Systems Center at the University of Maryland, is dedicated to providing a knowledge and resource base to support the development of competitive electronic components, products and systems. CALCE is run as a member-based colloquia whose research is directed by the members. CALCE has studied PEMs issues extensively. NASA maintains an agency-level membership for use by NASA civil servants and contractors actively working on applicable NASA contracts (application form is on-line on the CALCE website). Access to information on this website is limited without a user account.
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PEMs Information and Links: Non-NASA