Link to NASA Agency Website
NASA-NEPP Logo - Click to return to the NEPP Home Page    + View the NASA Portal
NEPP Website Search  
Powered By Google
Link to the NEPAG Home Page Link to the Photonics Page Link to the NEPP Parts Page Link to the NEPP Packaging Page Link to the NEPP Radiation Page Link to the DC/DC Converters Page Link to the NASA Parts Selection List
Link to the NASA Technical Standards Server Link to the NASA Workmanship Website Link to the Wirebond Website Link to the Tin Whiskers Home Page Link to the Plastic Encapsulated Microcircuits Page Link to the NEPP Publications Search Link to the NEPP Experts Page Link to the NEPP Calendar
Your Path: Home » Parts » Parts Links » Market Survey: SSR's » Section 1: Manufacturers & Assurance Levels Offered » Teledyne Technologies Inc.
  Aeroflex
  Agilent Technologies Inc.
  Ametek
  Data Device Corporation
  International Rectifier
  Leach International
  Micropac Industries Inc.
  National Hybrid Inc.
  Semitronics
Teledyne Technologies Inc.
  Tyco Electronics
  Search
 
 
 
 
Teledyne Technologies Inc.

Teledyne Technologies Inc.

 

12333 West Olympic Boulevard

 Los Angeles, CA  90064

(800) 284-7007

www.teledynerelays.com

 

For more than 40 years, Teledyne Relays has been recognized as an innovator and industry leader in manufacturing electromechanical and solid-state switching products. With headquarters in Hawthorne, CA , Teledyne Relays maintains six factories in California, Mexico, Taiwan,  and France . The company’s comprehensive product line meets a wide range of switching solutions for applications in RF& microwave; wireless & high-speed digital; instrumentation & test; aviation, military & space; motor, heating & lighting control.

 

Services/Capabilities:

·        Performs qualification testing per MIL-PRF-28750 or MIL-PRF-38534

·        Provides life testing per MIL-PRF-28750 or MIL-PRF-38534, MTBF & FIT per MIL-HDBK-217

·        Can provide both hermetic and environmental packaging

·        Can provide encapsulated designs

·        Plating options for packaging include electroless Nickel Plating and Gold Plating with Nickel underplating

·        Lead plating options include electroless Nickel Plating and Gold Plating with Nickel underplating

·        Provides screening to MIL-PRF-28750, MIL-PRF-38534, MIL-STD-883 or customer requirements

·        MIL-PRF-38534, Class H & K qualified and MIL-PRF-28750 qualified (also are qualified to MIL-PRF-19500, Jan S).  These specs send you to MIL-STD-883

·        Components to MIL-PRF-38534, Class K

·        Can build to SCDs in small volume but acceptance of such request will depend on design and cost

 

Privacy Policy and Important Notices NEPP Help for Site Navigation NEPP Feedback Form Link to the NEPP Site Map
USA.gov  
NASA Logo - Click to visit the NASA Agency Website
NEPP Program Manager: Michael J. Sampson
Responsible NASA Official: Michael J. Sampson
Webmaster: Carl M. Szabo, Jr.
      Last Updated: May 12, 2008