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Focused Packaging Issues Portals

The NEPP Program supports focused research and information dissemination for topics that are of heightened interest to the NASA parts engineering community.  The information collected to date particular to electronic packaging issues can be found through the following links:

 

Tin and other Metal Whiskers

 

Wire Bond Assessment and Reliability

 

DC/DC Converters

 

Plastic Encapsulated Microcircuits (PEMs)

 

MEMS

 
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NEPP Program Manager: Michael J. Sampson
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Webmaster: Carl M. Szabo, Jr.
      Last Updated: May 18, 2008