Dates: Jan 30th - Feb 1st, 2007
Where: NASA/GSFC Greenbelt, MD
Available presentation materials are indicated by the hyperlinks, below:
Time
Session
Topic
Presenter
Organization
8:30
Overview
Goals of the Workshop
Mike Sampson
NASA/GSFC
9:30
Challenges
Reliability
David Alexander
AFRL
10:00
10:30
Scaling
Lewis Cohn
DTRA
11:00
Power Devices
Leif Sheick
JPL
11:30
Challenges Associated with Modeling and Testing for Single Event Effects in Advanced Microelectronic Technologies
Robert Reed
Vanderbilt
12:00
13:30
SiGe
Rad and Extreme Environments
John Cressler
Ga. Inst Tech
14:30
SiGe Extreme Temp
Richard Patterson
NASA/GRC
15:00
An Industry Perspective on SiGe Qualification
Chuck Tabbert
Jazz Semiconductor
15:30
16:30
New Tech
Flex Circuits
Linda Del Castillo
17:00
Packaging Roadmap
Reza Ghaffarian
9:00
3D Packaging
Pramod Karulkar
University of Alaska Fairbanks
Insertion Approaches
David Sunderland
Boeing
10:15
Larry Harzstack
Aerospace Corp.
11:15
Mark White
14:00
Alexander Teverovsky
Reliability and Area Array Packages
Pradeep Lall
Auburn University
Panel Discussion
Kickoff – Where do we go from here?
Ken LaBel
17:30
FPGA
Complexity of FPGAs – Implications to Design Reliability and Radiation Performance
Melanie Berg
MEI – NASA/GSFC
CCGA
Testability/Reliability
Ramin Roosta
Doug Sheldon
CCGA Reliability
Raymon Kuang
Actel
TBD
Gary Swift
Heather Quinn
LANL
Xilinx and SIRF
Joe Fabula
Xilinx
Actel Reliability
Kangsen Huey
16:00
Aeroflex Status
Ron Lake
Aeroflex
Workshop Wrap-up