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Moisture Characteristics of Molding Compound and Environmental Effects in PEMs (slides)
File Name: Moisture_on_web.ppt | Date Submitted: 11/26/02
 

File Size:
1577KB
Document Author
Alexander Teverovsky - ateverov@pop300.gsfc.nasa.gov
GSFC on-site Contractor
Phone: 301 286-9691 | FAX: None On File
[Additional User Information]

Download "Moisture Characteristics of Molding Compound and Environmental Effects in PEMs (slides)" (1577KB) Now.
 
Description:
Moisture effects on PEMs.
 
Abstract:

As presented by Dr. Teverovsky in the NEPP Virtual Conference on PEM, November 21st, 2002
 
Related Project(s):
EPAC (Electronic Packaging)
EPAR (Electronic Parts)
 
Related Area(s) of Emphasis:

Error Diagnostic Information

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Date/Time: 10/12/08 19:39:54
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