+ View the NASA Portal NEPP Website Search   Powered By Google Your Path: Home » Parts » Parts Experts   Parts Publications Index   Parts Publications by Area of Emphasis   Parts Links Parts Experts   Parts Manufacturers   Focused Parts Issue Portals & NPSL   GSFC Parts Engineering Resources and Contacts   GSFC Specifications and Qualified Parts List Directory   Search         BACK to Publication List Task Plan - Interconnect Reliability of Cold Electronics File Name: Interconnect Reliability of Cold Electronics.doc | Date Submitted: 03/08/02   File Size: 43KB Document Author Reza Ghaffarian - Reza.Ghaffarian@jpl.nasa.gov Jet Propulsion Laboratory Phone: 818 354-2059 | FAX: 818 393-5245 [Additional User Information] Download "Task Plan - Interconnect Reliability of Cold Electronics" (43KB) Now.   Description: Interconnect Reliability of Cold Electronics   Abstract: Microelectronics is key enabler in meeting most NASA’s critical requirements for miniaturized spacecrafts.  Significant weight and cost saving will be achieved if they meet their life expectancy at extreme temperatures without  the use of heavy and costly additional heating and cooling systems.  DS-2 and MUSES CN NASA programs needed functionality at extremely cold temp to –120°C (even lower to -180°C) such requirement and are considered for Mar Exploration Programs.  Behavior of package and solder joint at extreme temperature are not well understood since these environments are generally unique to the solar systems and therefore NASA’s missions.  This task will address many quality and reliability assessment issues for high reliability conventional and advanced microelectronic packages as well as their commercial-off-the-shelf (COTS) versions.    Related Project(s): EPAC (Electronic Packaging)   Related Area(s) of Emphasis: Extreme Environment Electronics and Packaging     NEPP Program Manager: Michael J. Sampson Responsible NASA Official: Michael J. Sampson Webmaster: Carl M. Szabo, Jr.       Last Updated: November 29, 2007