Link to NASA Agency Website
NASA-NEPP Logo - Click to return to the NEPP Home Page    + View the NASA Portal
NEPP Website Search  
Powered By Google
Link to the NEPAG Home Page Link to the Photonics Page Link to the NEPP Parts Page Link to the NEPP Packaging Page Link to the NEPP Radiation Page Link to the DC/DC Converters Page Link to the NASA Parts Selection List
Link to the NASA Technical Standards Server Link to the NASA Workmanship Website Link to the Wirebond Website Link to the Tin Whiskers Home Page Link to the Plastic Encapsulated Microcircuits Page Link to the NEPP Publications Search Link to the NEPP Experts Page Link to the NEPP Calendar
Your Path: Home » Parts » Parts Experts
  Parts Publications Index
  Parts Publications by Area of Emphasis
  Parts Links
Parts Experts
  Parts Manufacturers
  Focused Parts Issue Portals & NPSL
  GSFC Parts Engineering Resources and Contacts
  GSFC Specifications and Qualified Parts List Directory
  Search
 
 
 
 
BACK to Publication List

Reliability of Electronics at Cryogenic Temperatures
File Name: Approach to Reliability Testing at cryo NEPP.pdf | Date Submitted: 12/05/05
 

File Size:
390KB
Document Author
Alexander Teverovsky - ateverov@pop300.gsfc.nasa.gov
GSFC on-site Contractor
Phone: 301 286-9691 | FAX: None On File
[Additional User Information]

Download "Reliability of Electronics at Cryogenic Temperatures" (390KB) Now.
 
Description:
 
Abstract:

Space exploration programs often require that sensors and instruments with related service electronics are exposed to outer space, thus subjecting them to extreme environmental conditions.  In programs such as lunar and Martian expeditions and deep-space exploration these conditions include cryogenic temperatures.  The major requirement for electronic components used in any space application is high reliability, which is assured by a system of screening and qualification testing and analyses designed to minimize the risk of failures during the mission. This system is well developed for components operating within the military range of temperatures (typically -55C to 125C); however, there are no established standards or guidelines that would help part engineers in developing reliability testing programs at cryogenic conditions.  Moreover, the reliability of electronic deives at these conditions has not been studied sufficiently yet and information is lacking even about the performance of active and passive components at extremely low temperatures.  This requires thorough analysis and planning of reliability testing for each case when a critical electronic component has to operate at cryogenic tempertures.

A microshutter array (MSA) in the Near-Infrared Spectrograph (NIRSPEC) instrument used in the James Webb Space Telescope (JWST) project will operate at temperatures in the range of 29K to 32K.  A high-voltage driver (HVD) microcircuit used to control the array will be mounted on the MSA board and will also operate at these extremely low temperatures.  This work analyzes reliability hazards of low-temperature conditions, evaluates the possibility of failures caused by different degradation mechanisms in microcircuits, and discusses specifics of HVD operation at cryogenic temperatures.  Performance of different types of ceramic and electrolytic capacitors used for decoupling of power supply signals and/or loading of the outputs at cryogenic conditions is also discussed.  Results of this work are being used to develop a reliability qualification testing plan for the HVD operating at cryogenic conditions.

 
Related Project(s):
EPAR (Electronic Parts)
 
Related Area(s) of Emphasis:
Advanced and Emerging Technologies
Extreme Environment Electronics and Packaging
MEMS/MOEMs Reliability Assurance

 
Privacy Policy and Important Notices NEPP Help for Site Navigation NEPP Feedback Form Link to the NEPP Site Map
USA.gov  
NASA Logo - Click to visit the NASA Agency Website
NEPP Program Manager: Michael J. Sampson
Responsible NASA Official: Michael J. Sampson
Webmaster: Carl M. Szabo, Jr.
      Last Updated: November 29, 2007