Abstract:
Fourteen different commercial linear and mixed signal plastic encapsulated microcircuits (PEMs) with lot quantities varying from 85 to more than 3500, have been screened and subjected to reliability qualification testing for several GSFC projects during 2003-2004 period. The testing included electrical measurements at three temperatures, burn-in (BI), acoustic microscopy (C-SAM mode), temperature cycling, high temperature operational life test (HTOL), and highly accelerated stress testing (HAST) at 130 oC/85% RH. The glass transition temperatures of molding compounds used were measured and compared with the data sheet temperatures of the parts and test results.
This presentation reports on statistics of the test data, revealed anomalies and problems, and on results of failure analysis. The effectiveness of different testing procedures and in particular, CSAM examinations is discussed. The lessons learned from this experience have been used to improve the GSFC guidelines for design evaluation, screening, and qualification of commercial parts intended for space applications.
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