+ View the NASA Portal NEPP Website Search   Powered By Google Your Path: Home » Parts » Parts Experts   Parts Publications Index   Parts Publications by Area of Emphasis   Parts Links Parts Experts   Parts Manufacturers   Focused Parts Issue Portals & NPSL   GSFC Parts Engineering Resources and Contacts   GSFC Specifications and Qualified Parts List Directory   Search         Dr. Liangyu Chen-Author PI [ENGINEER] Contact Information: Liangyu.Chen@grc.nasa.gov Phone: 216-433-6458 FAX: 216-433-8000 Organization/Employer: Glenn Research Center http://www.grc.nasa.gov NASA/GRC 21000 Brookpark Rd Cleveland, Ohio 44135 216-433-4000 Authored Publications: 1. BOK of Applications of Wireless Data Systems in High Temperature Environments   Task Deliverable | File Size: 512KB | File Date: 7/1/05 2. Task Plan - 04-028 High Temperature Wireless Sensing for Health Monitoring   Task Plan | File Size: 71KB | File Date: 1/29/04 3. Video: Electronic Packaging Technology for SiC based High Temperature Micro-systems - Questions   Presentation | File Size: 1091KB | File Date: 4/16/01 4. Video: Electronic Packaging Technology for SiC based High Temperature Micro-systems - Part 3   Presentation | File Size: 1604KB | File Date: 4/16/01 5. Task Plan - Packaging of High Temperature SiC Based Electronics and MEMS Pressure Sensor   Task Plan | File Size: 135KB | File Date: 6. Packaging of High Temperature SiC Based Electronics   Whitepaper | File Size: 6200KB | File Date: 7/1/01 7. Task Plan - 06-287 Wide Band Gap Technology - Reliability   Task Plan | File Size: 71KB | File Date: 11/1/05 8. Silicon Carbide Die Attach Scheme for 500°C Operation   Task Deliverable | File Size: 898KB | File Date: 9/00 9. Packaging Technology for 500° SiC Microsystems   Presentation | File Size: 364KB | File Date: 5/15/01 10. Temperature Dependant Dielectric Properties of Polycrystalline 96% Al2O3   Task Deliverable | File Size: 67KB | File Date: 9/1/04 11. Technology Survey of SiC High Temperature Microsystems Packaging   Task Deliverable | File Size: 331KB | File Date: 9/1/05 12. Task Plan - 05-027a SiC Packaging for Wide Band-Gap Microsystems   Task Plan | File Size: 243KB | File Date: 13. Video: Electronic Packaging Technology for SiC based High Temperature Micro-systems - Part 2   Presentation | File Size: 2580KB | File Date: 4/16/01 14. Thick and Thin Film Materials Based Chip Level Packaging for High Temperatures SiC Sensors and Devic   Task Deliverable | File Size: 222KB | File Date: 9/01/00 15. Video: Electronic Packaging Technology for SiC based High Temperature Micro-systems - Part 1   Presentation | File Size: 2512KB | File Date: 4/16/01 16. Structure Optimization of Au Wire Wedge-bond for High Temperature Applications   Report | File Size: 176KB | File Date: 5/10/04 17. Die Attach Technology to Reduce Die Stresses in MEMs Pressure Sensors   Task Deliverable | File Size: 1169KB | File Date: 5/17/04 18. Structure Optimization of Au Wire Wedge-Bond for High Temperature Applications   Task Deliverable | File Size: 169KB | File Date: 9/1/04 19. Technology Readiness Overview: SiC High Temperature Microsystems and Packaging   Task Deliverable | File Size: 2971KB | File Date:   NEPP Program Manager: Michael J. Sampson Responsible NASA Official: Michael J. Sampson Webmaster: Carl M. Szabo, Jr.       Last Updated: November 29, 2007