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Analysis of Failure Modes in Therm Actuated MEMS Relays
File Name: DTIP2003_Micromachined Relay_paper2C.doc.pdf | Date Submitted: 03/19/03
File Size:
236KB
Document Author
Alexander Teverovsky
-
ateverov@pop300.gsfc.nasa.gov
GSFC on-site Contractor
Phone: 301 286-9691 | FAX: None On File
[Additional User Information]
Download "Analysis of Failure Modes in Therm Actuated MEMS Relays" (236KB) Now.
Description:
Abstract:
Related Project(s):
EPAR (Electronic Parts)
Related Area(s) of Emphasis:
Extreme Environment Electronics and Packaging
MEMS/MOEMs Reliability Assurance
NEPP Program Manager:
Michael J. Sampson
Responsible NASA Official:
Michael J. Sampson
Webmaster:
Carl M. Szabo, Jr.
Last Updated: November 29, 2007