WBG high temperature microelectronics are essential to many NASA space and aeronautic applications, such as launching site safety monitoring, Venus missions, and aerospace engine technology. Silicon carbide (SiC) sensors and electronic devices have been demonstrated for operation at high temperatures up to 500 - 600oC.  However, packaging for these devices have not been systematically validated. Some SiC devices are commercially available, but these devices are designed for high temperature applications because of the lack of supporting packaging technology.  In order to expedite the application of WBG technology for NASA missions, NEPP has been supporting evaluation efforts in high temperature packaging. This work has already resulted in basic packaging technology which has successfully facilitated SiC device tests at 500oC for over thousands of hours.  This task evaluates test-vehicles composed of commercial (Cree) SiC devices and advanced packaging technologies for high temperature applications.