Task Plan - Micro-Opto-Electro-Mechanical Systems (MOEMS) Interconnects
File Name: Micro-Opto-Electro-Mechanical Systems Interconnects.doc | Date Submitted: 03/08/02
Description:
Micro-Opto-Electro-Mechanical Systems (MOEMS) Interconnects
Abstract:
Opto MEMs device and package interconnections will be test validated to determine their quality and reliability and develop inspection methodologies. The MOEMS have potential of replacing many large and massive electrical, mechanical, and optical systems. For example, for NGST mission, at least three independent proposals recommended the use of MOEMS. These included the use of micromirrors and deformable mirrors, and microshutters. In this task, in addition to commercially available packages, devices developed by NASA and other industry team will be selected for generating statistically meaningful test results on interconnections and will develop inspection procedures for manufacturing defect detection by inspection. Test results will provide as standard/inspection criteria guidance. Knowledge and experience gained by this task will be used to effectively support NASA’s projects in MOEMS areas.
Related Project(s):
EPAC (Electronic Packaging)
Related Area(s) of Emphasis:
MEMS/MOEMs Reliability Assurance
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