+ View the NASA Portal NEPP Website Search   Powered By Google Your Path: Home » Parts » Parts Experts   Parts Publications Index   Parts Publications by Area of Emphasis   Parts Links Parts Experts   Parts Manufacturers   Focused Parts Issue Portals & NPSL   GSFC Parts Engineering Resources and Contacts   GSFC Specifications and Qualified Parts List Directory   Search         BACK to Publication List Packaging Technology for 500° SiC Microsystems File Name: Chen_PackagingTechnology.pdf | Date Submitted: 10/04/01   File Size: 364KB Document Author Liangyu Chen-Author PI - Liangyu.Chen@grc.nasa.gov Glenn Research Center Phone: 216-433-6458 | FAX: 216-433-8000 [Additional User Information] Download "Packaging Technology for 500° SiC Microsystems" (364KB) Now.   Description: 2nd Annual NEPP Conference   Abstract: Background: motivations Electrical and mechanical characterization facilities Thick-film metallization based electrical interconnections Validation results 500°operable low electrical resistance die-attach Method and evaluation results Summary High temperature MEMS packaging Thermal mechanical stability of die-attach Acknowledgements   Related Project(s): EPAC (Electronic Packaging)   Related Area(s) of Emphasis: Extreme Environment Electronics and Packaging Advanced Interconnect Reliability MEMS/MOEMs Reliability Assurance     NEPP Program Manager: Michael J. Sampson Responsible NASA Official: Michael J. Sampson Webmaster: Carl M. Szabo, Jr.       Last Updated: November 29, 2007