+ View the NASA Portal NEPP Website Search   Powered By Google Your Path: Home » Parts » Parts Experts   Parts Publications Index   Parts Publications by Area of Emphasis   Parts Links Parts Experts   Parts Manufacturers   Focused Parts Issue Portals & NPSL   GSFC Parts Engineering Resources and Contacts   GSFC Specifications and Qualified Parts List Directory   Search         Mr. Alexander Teverovsky Contact Information: ateverov@pop300.gsfc.nasa.gov Phone: 301 286-9691 Organization/Employer: GSFC on-site Contractor NASA GSFC Greenbelt, Maryland 20771 301-286-0000 This User is a NEPP Author Author's Bio: Alexander Teverovsky received Ph.D. in electrical engineering from Moscow University of Electronics, Russia. He worked at the Moscow Institute of Electronic Machine Building developing techniques to analyze charge instabilities in MOS structures and specializing in reliability physics of semiconductor devices. Dr. Teverovsky joined the Goddard Space Flight Center parts analysis lab in 1994 as a senior failure analyst performing failure analysis and design evaluation of hybrids, microcircuits, and discrete active and passive components. Starting in 2000, he has been working on evaluation of new technologies and components for space applications including SOI technology, DC-DC converters, ferroelectric memory devices (FRAMs), microelectromechanical systems (MEMs), tantalum capacitors, and plastic encapsulated microcircuits (PEMs). Dr. Teverovsky is author of more than 60 technical publications and holds several patents on test techniques. Authored Publications: 1. Package induced instability in voltage reference PEMs (slides)   PEMs Test Data | File Size: 488KB | File Date: 6/17/03 2. Moisture Characteristics of Molding Compound and Environmental Effects in PEMs (slides)   PEMs Test Data | File Size: 1577KB | File Date: 11/21/02 3. Chlorine contamination diffusion in silicones   PEMs Test Techniques | File Size: 791KB | File Date: 10/10/99 4. Effect of Inductance and Requirements for Surge Current Testing of Tantalum Capacitors   Whitepaper | File Size: 303KB | File Date: 10/1/05 5. Reliability of Electronics at Cryogenic Temperatures   Whitepaper | File Size: 390KB | File Date: 10/05/05 6. Results of Screening and Qualification Testing of COTS PEMs for Space Applications and Lessons Learn   PEMs Test Data | File Size: 1372KB | File Date: 2/14/05 7. PEMS-INST-001 (pointer)   PEMs Guidelines | File Size: 25KB | File Date: 06/01/03 8. Reliability Effects of Surge Current Testing of Solid Tantalum Capacitors   Task Deliverable | File Size: 1289KB | File Date: 12/01/07 9. Moisture diffusion in molding compounds and quality assurance of PEMs for space applications   PEMs Overview | File Size: 1184KB | File Date: 12/09/02 10. Effect of Environments on Degradation of Molding Compound and Wire Bonds in PEMs   Whitepaper | File Size: 1003KB | File Date: 10/1/05 11. Effect_of_SCT_on_reliability   Task Deliverable | File Size: 502KB | File Date: 12. Task Plan - 08-002-1 Effect of Mechanical Stresses on Ceramic Capacitors   Task Plan | File Size: 60KB | File Date: 13. Report on Tantalum Capacitor Reliability   Task Deliverable | File Size: 1328KB | File Date: 01/01/07 14. Analysis of Failure Modes in Therm Actuated MEMS Relays   Whitepaper | File Size: 236KB | File Date: 3/19/03 15. Thermal Impedance Measurements for Quality Assessment of Metallurgically Bonded Diodes   Report | File Size: 2369KB | File Date: 10/10/2001 16. Effect of Surge Current Testing on Reliability of Solid Tantalum Capacitors   Task Deliverable | File Size: 502KB | File Date: 05/16/08 17. Effect of Surge Current Testing on Reliability of Solid Tantalum Capacitors   Presentation | File Size: 502KB | File Date: 3/25/08 18. Reliability of Tantalum Capacitors   Task Deliverable | File Size: 303KB | File Date: 10/01/05 19. Qualification of PEMs Using Board-level Testing   PEMs Overview | File Size: 15517KB | File Date: 1/06/02 20. Measurements of Thermo-Mechanical Characteristics of PEMs for Failure Analysis and Reliability Evalu   Presentation | File Size: 1911KB | File Date: 6/7/04 21. Effect of Inductance NEPP report   Task Deliverable | File Size: 303KB | File Date: 22. GSFC Parts Engineering in COTS PEMs era (slides)   Presentation | File Size: 687KB | File Date: 2/17/04 23. EOS Simulation and Failure Analysis of Metallurgically Bonded Silicon Diodes.   Whitepaper | File Size: 4020KB | File Date: 10/10/2001 24. Evaluation of Micromachined Relays for Space Applications   Presentation | File Size: 12842KB | File Date: 2/03/03 25. A Technique for Assessing the Moisture Resistance of PEMs Using MOS Test Structures   PEMs Test Techniques | File Size: 1019KB | File Date: 10/10/98 26. Reliability Evaluation of Thermally Actuated Micromachined Relays for Space Applications   Task Deliverable | File Size: 2896KB | File Date: 11/04/2002 27. Solder Reflow   Task Deliverable | File Size: 1777KB | File Date: 05/16/08 28. Environmentally Induced Swelling and Shrinkage of Molding Compounds in PEMs   PEMs Test Data | File Size: 3937KB | File Date: 10/15/02 29. Failures in Hybrid Microcircuits during Environmental Testing   Task Deliverable | File Size: 3056KB | File Date: 05/16/08 30. Reverse-Bias Degradation of SiGe Transistors at Normal and Cryogenic Temperatures   Presentation | File Size: 755KB | File Date: 3/02/05 31. Characteristic Times of Moisture Diffusion and Bake-out Conditions for Plastic Encapsulated Parts   PEMs Test Techniques | File Size: 2216KB | File Date: 10/15/02 32. APPLICATION OF THERMO-MECHANICAL MEASUREMENTS OF PLASTIC PACKAGES FOR RELIABILITY EVALUATION OF PEMS   Conference Proceeding | File Size: 927KB | File Date: 6/07/04 33. Failures in Hybrid Microcircuits during Environmental Testing   Presentation | File Size: 3056KB | File Date: 34. Reliability of Tantalum Capacitors   Task Deliverable | File Size: 303KB | File Date: 10/01/05 35. EV72015_LT1014IS   PEMs Test Data | File Size: 725KB | File Date: 02/22/02 36. Moisture effects in PEMs intended for space applications (slides)   PEMs Overview | File Size: 5247KB | File Date: 4/12/02 37. Effect of Vacuum on High-Temperature Degradation of Au-Al Wire Bonds in PEMS   PEMs Test Data | File Size: 1147KB | File Date: 4/19/04 38. Lessons Learned from Screening and Qualification of COTS PEMs for Space Applications (slides)   PEMs Test Data | File Size: 1063KB | File Date: 2/17/04 39. PEM-INST-001 Instructions for Plastic Encapsulated Microcircuit (PEM) Select, Screen, & Qualify   PEMs Test Techniques | File Size: 1269KB | File Date: 40. Task Plan - 07-270 Reliability Effects of Surge Current Testing   Task Plan | File Size: 78KB | File Date: 41. EV78074_58V1001T25   PEMs Test Data | File Size: 1051KB | File Date: 02/22/02 42. Report: Reliability of Tantalum Capacitors   Task Deliverable | File Size: 303KB | File Date: 10/05/05 43. Reverse-Bias Degradation of SiGe Transistors at Normal and Cryogenic Temperatures - Ext'd Abstract   Conference Proceeding | File Size: 105KB | File Date: 3/02/05 44. EV61261_LT1014IS   PEMs Test Data | File Size: 439KB | File Date: 02/22/02 45. Moisture Characteristics of Molding Compounds in PEMs (slides)   PEMs Overview | File Size: 10191KB | File Date: 10/25/02 46. Impact of Tg of Molding Compounds on Screening and Reliability Qual of PEMs for Space (slides)   Presentation | File Size: 648KB | File Date: 11/12/03 47. Environmental Stress Testing of Power Transistors Encapsulated in Plastic Packages   PEMs Test Techniques | File Size: 921KB | File Date: 11/22/04 48. Impact of Tg of Molding Compounds on Screening and Reliability Qual of PEMs for Space (paper)   PEMs Test Data | File Size: 161KB | File Date: 11/12/03 49. Relay Failures Specific to Space Applications   Whitepaper | File Size: 886KB | File Date: 10/10/2000 50. A Rapid Technique for Moisture Diffusion Characterization of Molding Compounds in PEMs   PEMs Test Techniques | File Size: 3863KB | File Date: 10/15/02 51. Solder Reflow Failures in Electronic Components during Manual Soldering   Conference Proceeding | File Size: 1777KB | File Date: 3/27/08 52. Environmental Hysteresis in Moulding Compounds and Volt Reference PEMs: White Paper   PEMs Test Data | File Size: 160KB | File Date: 3/19/03 53. Effect of Moisture on Characteristics of Surface Mount Solid Tantalum Capacitors   Whitepaper | File Size: 596KB | File Date: 2/04/03 54. Lessons Learned from Screening and Qualification Testing of COTS PEMS in 2004   PEMs Overview | File Size: 1372KB | File Date: 2/14/05 55. Degradation of Molding Compound and Wire Bonds in PEMs   Task Deliverable | File Size: 1003KB | File Date: 10/01/05 56. Reliability Evaluation of Linear PEMs Rejected During C-SAM Examination (slides)   PEMs Test Techniques | File Size: 803KB | File Date: 2/17/04 57. PEMs Research   PEMs Test Techniques | File Size: 1574KB | File Date: 07/30/04 58. Environmental Hysteresis in Moulding Compounds and Volt Reference PEMs: Presentation   PEMs Test Data | File Size: 2703KB | File Date: 2/20/03 59. Reverse Bias Behavior of Surface Mount Solid Tantalum Capacitors   Whitepaper | File Size: 681KB | File Date: 2/26/02 60. DPA Guide for PEMs - Draft   PEMs Test Techniques | File Size: 35KB | File Date: 02/22/02 61. Degradation of Surface Mount Solid Tantalum Capacitors in Humid Environments   Presentation | File Size: 17014KB | File Date: 3/19/03 62. Effect of Vacuum on High Temperature Degredation of Gold/Aluminum Wire Bonds in PEMs   PEMs Test Data | File Size: 1147KB | File Date: 3/8/04 63. Moisture-related failures of operational amplifiers in plastic packages   PEMs Test Techniques | File Size: 1285KB | File Date: 8/16/04 64. In-situ Measurements of Thermo-Mechanical Characteristics of Molding Compounds in PEMs   PEMs Test Data | File Size: 2280KB | File Date: 9/02/03 65. Task Plan - 08-003-2 Factors Affecting Reliability of Solid Tantalum Capacitors   Task Plan | File Size: 59KB | File Date: 66. INTRODUCING A NEW MEMBER TO THE FAMILY: GOLD WHISKERS   Whitepaper | File Size: 709KB | File Date: 4/15/03 67. Reliability of COTS PEMS   PEMs Other Documents | File Size: 1003KB | File Date: 10/01/05 68. High-Temperature Degradation of Wire Bonds in Plastic Encapsulated Microcircuits   PEMs Test Techniques | File Size: 458KB | File Date: 6/20/05 This User is a member of the NEPP Experts List Area(s) Of Expertise: Microcircuits - Memory Microcircuits - Plastic Encapsulated (PEMs) Advanced and Emerging Technologies   NEPP Program Manager: Michael J. Sampson Responsible NASA Official: Michael J. Sampson Webmaster: Carl M. Szabo, Jr.       Last Updated: November 29, 2007