Abstract:
Although the weakest link of chip scale package (CSP) assembly reliability has been often internal package failure, solder joint fatigue is still considered to be the key factor for reliability. Other key factors that affect solder joint reliability including package type, package build, board design, assembly variables, and accelerated environmental testing are also discussed. The reasons for unrealistic life projections for CSP assembly reliability by numerous modelers is also examined. It was concluded that availability of meaningful assembly reliability test results are needed to accelerate implementation of this technology. The JPL-led CSP consortia are addressing many of these issues.
Related Project(s):
EPAC (Electronic Packaging)
Related Area(s) of Emphasis:
High Density Packaging Technologies
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