+ View the NASA Portal NEPP Website Search   Powered By Google Your Path: Home » Parts » Parts Experts   Parts Publications Index   Parts Publications by Area of Emphasis   Parts Links Parts Experts   Parts Manufacturers   Focused Parts Issue Portals & NPSL   GSFC Parts Engineering Resources and Contacts   GSFC Specifications and Qualified Parts List Directory   Search         BACK to Publication List Technology Survey of SiC High Temperature Microsystems Packaging File Name: Technology Survey of SiC High Temperature Microsystems Packaging.pdf | Date Submitted: 08/04/05   File Size: 331KB Document Author Liangyu Chen-Author PI - Liangyu.Chen@grc.nasa.gov Glenn Research Center Phone: 216-433-6458 | FAX: 216-433-8000 [Additional User Information] Download "Technology Survey of SiC High Temperature Microsystems Packaging" (331KB) Now.   Description: Technology Survey of SiC High Temperature Microsystems   Abstract:   Related Project(s): EPAC (Electronic Packaging)   Related Area(s) of Emphasis: Extreme Environment Electronics and Packaging Compound Semiconductor/Microwave Device Technologies Advanced Interconnect Reliability     NEPP Program Manager: Michael J. Sampson Responsible NASA Official: Michael J. Sampson Webmaster: Carl M. Szabo, Jr.       Last Updated: November 29, 2007