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Characteristic Times of Moisture Diffusion and Bake-out Conditions for Plastic Encapsulated Parts
File Name: Characteristic Times and bake-out 2.doc | Date Submitted: 10/15/02
 

File Size:
2216KB
Document Author
Alexander Teverovsky - ateverov@pop300.gsfc.nasa.gov
GSFC on-site Contractor
Phone: 301 286-9691 | FAX: None On File
[Additional User Information]

Download "Characteristic Times of Moisture Diffusion and Bake-out Conditions for Plastic Encapsulated Parts" (2216KB) Now.
 
Description:
Simple equations for calculation of the characteristic times of moisture diffusion in plastic packages of different shapes and sizes are suggested.
 
Abstract:
 

Simple equations for calculation of the characteristic times of moisture diffusion in plastic packages of different shapes and sizes are suggested.  It is shown that the moisture-prevention strategy can be developed and the adequate bake-out regimens for different situations can be calculated based on the temperature dependency of the moisture diffusion coefficient, D(T), of encapsulating polymer materials.  

Moisture diffusion characteristics of molding compounds used in plastic encapsulated microcircuits (PEMs) available in the literature have been analyzed and typical D(T) characteristics are calculated.  The bake-out times calculated using averaged diffusion characteristics of molding compounds are in agreement with the JEDEC recommendations.  Examples of calculations of bake-out regimens for parts allowing only low temperature treatment and for parts temporarily exposed to high humidity conditions are considered.
 
Related Project(s):
EPAC (Electronic Packaging)
EPAR (Electronic Parts)
 
Related Area(s) of Emphasis:

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