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Task Plan - 05-027a SiC Packaging for Wide Band-Gap Microsystems
File Name: 04-027_GRC_T-8-19_Quad Chart SiC packaging_01-29-04.ppt | Date Submitted: 08/02/05
 

File Size:
243KB
Document Author
Liangyu Chen-Author PI - Liangyu.Chen@grc.nasa.gov
Glenn Research Center
Phone: 216-433-6458 | FAX: 216-433-8000
[Additional User Information]

Download "Task Plan - 05-027a SiC Packaging for Wide Band-Gap Microsystems " (243KB) Now.
 
Description:
 
Abstract:
 
Related Project(s):
EPAC (Electronic Packaging)
 
Related Area(s) of Emphasis:
Advanced and Emerging Technologies
Compound Semiconductor/Microwave Device Technologies

 
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