+ View the NASA Portal NEPP Website Search   Powered By Google Your Path: Home » Parts » Parts Experts   Parts Publications Index   Parts Publications by Area of Emphasis   Parts Links Parts Experts   Parts Manufacturers   Focused Parts Issue Portals & NPSL   GSFC Parts Engineering Resources and Contacts   GSFC Specifications and Qualified Parts List Directory   Search         BACK to Publication List A Systems Approach for Quality and Reliability of Chip Scale Package Assembly File Name: RG-IEEE-3-99.pdf | Date Submitted: 09/25/01   File Size: 629KB Document Author Reza Ghaffarian - Reza.Ghaffarian@jpl.nasa.gov Jet Propulsion Laboratory Phone: 818 354-2059 | FAX: 818 393-5245 [Additional User Information] Download "A Systems Approach for Quality and Reliability of Chip Scale Package Assembly" (629KB) Now.   Description:   Abstract: This paper reviews many factors that affect interconnect reliability of commercial-off-the-shelf (COTS) chip scale package (CSP) assemblies. These include: package type, package build, voard design, and assembly variables. Methods of accelerated environmental testing were discussed and reasons for unrealistic life projections for CSP assembly reliability by numerous modelers is also examined. Prelinimary thermal cycling test results in the rance of -30°C to 100°C for test cehicles, especially a double sided assembly were also presented. It was concluded that availibility of meaningful assembly reliabiity test results are needed to accelerate implementation of this technology. The JPL-led CSP consortia are addressing many of these issues.   Related Project(s): EPAC (Electronic Packaging)   Related Area(s) of Emphasis: High Density Packaging Technologies Advanced Interconnect Reliability     NEPP Program Manager: Michael J. Sampson Responsible NASA Official: Michael J. Sampson Webmaster: Carl M. Szabo, Jr.       Last Updated: November 29, 2007