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Structure Optimization of Au Wire Wedge-bond for High Temperature Applications
File Name: 7th HiTEC Wirebond Reliability paper.pdf | Date Submitted: 06/07/05
 

File Size:
176KB
Document Author
Liangyu Chen-Author PI - Liangyu.Chen@grc.nasa.gov
Glenn Research Center
Phone: 216-433-6458 | FAX: 216-433-8000
[Additional User Information]

Download "Structure Optimization of Au Wire Wedge-bond for High Temperature Applications" (176KB) Now.
 
Description:
 
Abstract:
 
Related Project(s):
EPAC (Electronic Packaging)
EPAR (Electronic Parts)
 
Related Area(s) of Emphasis:
High Density Packaging Technologies
Extreme Environment Electronics and Packaging

 
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