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Mr. Reza Ghaffarian

Contact Information:
Reza.Ghaffarian@jpl.nasa.gov
Phone: 818 354-2059
FAX: 818 393-5245

Organization/Employer:
Jet Propulsion Laboratory
http://www.jpl.nasa.gov
4800 Oak Grove Drive
Pasadena, California 91109-8099
818-354-1500

This User is a NEPP Author

Author's Bio:
Dr. Reza Ghaffarian has 20 years of industrial and academic experience in mechanical, materials, and manufacturing process engineering. At JPL, Quality Assurance Section, he supports research and development activities in SMT, BGA, CSP, and MEMS/MOEMS technologies for infusion into NASA’s missions. He was the recipient of NASA Exception Service Medal for outstanding leadership, industrial partnering, and expertise in failure modes and effects analysis and environmental testing of electronic packaging technologies. He has authored more than 100 technical papers, co-editor of a CSP book, 3 book chapters, two guidelines, and numerous patentable innovations. He serves as technical advisor/Committee to Chip Scale Review Magazine, Microelectronics Journal, SMTA, IMAPS, and IPC. He is a frequent speaker and chaired technical conferences including SMTA International, IMAPS, ASME, SAMPE, NEPCON, SEMI, IEEE CPMT, and IPC. He received his M.S. in 1979, Engineering Degree in 1980, and Ph.D. in 1982 in engineering from University of California at Los Angeles (UCLA).

Authored Publications:

1.	Chip Scale Package Implementation Challenges
	Whitepaper \| File Size: 1096KB \| File Date: 11/15/99
2.	Task Plan - 07-108 Reliability of Recolumned Area Array Packages
	Task Plan \| File Size: 70KB \| File Date:
3.	Commercial-Off-The-Shelf Microelectromechanical Systems
	Whitepaper \| File Size: 52KB \| File Date: 2/4/00
4.	Task Plan - Interconnect Reliability of Cold Electronics
	Task Plan \| File Size: 43KB \| File Date:
5.	CCGA packages for space applications
	Task Deliverable \| File Size: 2410KB \| File Date: 07/17/06
6.	Task Plan - 04-035 Guidance For 0201 Passive Technologies
	Task Plan \| File Size: 78KB \| File Date:
7.	Reliability of PWB Microvias for High Density Package Assembly Body of Knowledge (BOK)
	Task Deliverable \| File Size: 1246KB \| File Date: 6/1/06
8.	Monte Carlo Simulation of BGA Failure Distributions for Virtual Qualification
	Whitepaper \| File Size: 161KB \| File Date: 1/99
9.	Task Plan - 05-075 Ceramic Column Grid Array Reliability
	Task Plan \| File Size: 127KB \| File Date:
10.	Impact of Print Parameters and CSP Pitch and I/O on Paste Quality and Volume
	Task Deliverable \| File Size: 162KB \| File Date: 7/1/00
11.	Thermal Cycling/Shock Behavior of CSP Assemblies
	Whitepaper \| File Size: 91KB \| File Date: 7/01/01
12.	Task Plan - 05-006A Package Level Testing – Alternate Approaches
	Task Plan \| File Size: 25KB \| File Date:
13.	Thermal Cycling Test Results of CSP and RF Package Assemblies
	Task Deliverable \| File Size: 301KB \| File Date: 7/1/00
14.	Task Plan - 07-107
	Task Plan \| File Size: 87KB \| File Date:
15.	Technology Readiness Overview: Ball Grid Array and Chip Scale Packaging
	Task Deliverable \| File Size: 350KB \| File Date: 01/23/03
16.	Task Plan - Micro-Opto-Electro-Mechanical Systems (MOEMS) Interconnects
	Task Plan \| File Size: 64KB \| File Date:
17.	Task Plan - 05-013A Extreme Environments: Cold/Hot Reliability
	Task Plan \| File Size: 25KB \| File Date:
18.	Task Plan - 05-002 Microvia
	Task Plan \| File Size: 61KB \| File Date:
19.	0607 Xilinx/NASA: Assembly Reliability for Two CCGA Packages (slides)
	Presentation \| File Size: 3454KB \| File Date: 6/26/06
20.	Thermal and Mechanical Reliability of Five COTS MEMS Accelerometers
	Whitepaper \| File Size: 780KB \| File Date: 2/26/02
21.	CSP Reliability for Single- and Double-Sided Assemblies
	Whitepaper \| File Size: 514KB \| File Date: 11/30/99
22.	Variables Affecting CSP Reliability
	Periodical \| File Size: 233KB \| File Date: 4/1/99
23.	Ball Grid Array Assembly Reliability - NEPP WebEx Series #3
	Presentation \| File Size: 2629KB \| File Date:
24.	Task Plan - 04-013 Extreme Environments: Cold/Hot Temperature Reliability
	Task Plan \| File Size: 65KB \| File Date:
25.	Assembly Reliability of Ball Grid Array and Chip Scale Packages for High Reliability Applications
	Whitepaper \| File Size: 1026KB \| File Date: 01/01/98
26.	Task Plan - SIAP / SOAC - System-in-a-Package / System-on-a-Chip Assessment Qualification
	Task Plan \| File Size: 260KB \| File Date:
27.	Accelerated Thermal Cycling and Failure Mechanisms for BGA and CSP Assemblies
	Whitepaper \| File Size: 320KB \| File Date: 11/15/99
28.	Shock and Thermal Cycling Synergism Effects on Reliability of CBGA Assemblies
	Whitepaper \| File Size: 1332KB \| File Date: 3/99
29.	A Systems Approach for Quality and Reliability of Chip Scale Package Assembly
	Whitepaper \| File Size: 629KB \| File Date: 10/27/99
30.	Task Plan - MEMS Reliability Assurance
	Task Plan \| File Size: 15KB \| File Date: 10/1/99
31.	Effect of Area Array Package Types on Assembly Reliability and Comments on IPC-9701A
	Task Deliverable \| File Size: 1550KB \| File Date: 11/7/05
32.	CSP Assembly Reliability: Commercial and Harsh Environments
	Whitepaper \| File Size: 361KB \| File Date: 11/15/99
33.	Chip-Scale Package Reliability-Has it Been Proven?
	Whitepaper \| File Size: 63KB \| File Date: 11/30/99
34.	Accelerated Thermal and Mechanical Testing of CSP
	Whitepaper \| File Size: 182KB \| File Date: 1/1/01
35.	Manufacturing Robustness of CSP on an SMT Line
	Whitepaper \| File Size: 244KB \| File Date: 11/99
36.	Ball Grid Array Reliability Assessment for Aerospace Applications
	Whitepaper \| File Size: 602KB \| File Date: 1/99
37.	Task Plan - Robust Manufacturing Processes for CSPs
	Task Plan \| File Size: 26KB \| File Date: 10/1/99
38.	Close the Information Gap on IC-Package Reliability
	Whitepaper \| File Size: 37KB \| File Date:
39.	Task Plan - 04-006 Package Level Testing – Alternate Approaches
	Task Plan \| File Size: 59KB \| File Date:
40.	Task Plan - 08-132-2 Reliability of Recolumned Area Array Packages
	Task Plan \| File Size: 9KB \| File Date:
41.	Task Plan - COTS MEMs Sensors-Accelerometers Quality & Reliability
	Task Plan \| File Size: 170KB \| File Date:
42.	Task Plan - 08-131-2 Realiability of Low Pitch High I/O Area Array Packages
	Task Plan \| File Size: 9KB \| File Date:
43.	Thermal Cycle Reliability and Failure Mechanisms of CCGA and PBGA Assbs / and W/o Corner Staking
	Task Deliverable \| File Size: 344KB \| File Date: 6/6/05
44.	Assembly and Cleaning of CSPs for High, Low, and UltraLow Volume Applications
	Conference Proceeding \| File Size: 529KB \| File Date: 9/1/00
45.	Task Plan - 06-075a 1000 Pin Packages, CGA Evaluation
	Task Plan \| File Size: 71KB \| File Date:

This User is a member of the NEPP Experts List

Area(s) Of Expertise:
Advanced and Emerging Technologies
Advanced Interconnect Reliability

			NEPP Program Manager: Michael J. Sampson Responsible NASA Official: Michael J. Sampson Webmaster: Carl M. Szabo, Jr.
			Last Updated: November 29, 2007