Link to NASA Agency Website
NASA-NEPP Logo - Click to return to the NEPP Home Page    + View the NASA Portal
NEPP Website Search  
Powered By Google
Link to the NEPAG Home Page Link to the Photonics Page Link to the NEPP Parts Page Link to the NEPP Packaging Page Link to the NEPP Radiation Page Link to the DC/DC Converters Page Link to the NASA Parts Selection List
Link to the NASA Technical Standards Server Link to the NASA Workmanship Website Link to the Wirebond Website Link to the Tin Whiskers Home Page Link to the Plastic Encapsulated Microcircuits Page Link to the NEPP Publications Search Link to the NEPP Experts Page Link to the NEPP Calendar
Your Path: Home » Parts » Parts Experts
  Parts Publications Index
  Parts Publications by Area of Emphasis
  Parts Links
Parts Experts
  Parts Manufacturers
  Focused Parts Issue Portals & NPSL
  GSFC Parts Engineering Resources and Contacts
  GSFC Specifications and Qualified Parts List Directory
  Search
 
 
 
 
BACK to Publication List

Does Red Phosphorus in Molding Compounds for Electronic Devices Present a Reliability Risk?
File Name: Abstract_Use_of_Phosphorus_in_PEMs.doc | Date Submitted: 10/23/02
 

File Size:
29KB
Document Author
Ashok Sharma - asharma@pop300.gsfc.nasa.gov
Goddard Space Flight Center
Phone: 301 286-6165 | FAX: 301 286-1695
[Additional User Information]

Download "Does Red Phosphorus in Molding Compounds for Electronic Devices Present a Reliability Risk?" (29KB) Now.
 
Description:
Overview and Quick Links
 
Abstract:

Failures, in the form of electrical leakage and metal dendrite growth between conductors have been linked with Red Phosphorous particles in PEMs encapsulant.  CALCE has published their study of this issue.  An overview and a link to the paper can be found at:

 

http://www.calce.umd.edu/whats_new/2002/Phosphorus_020926.htm

 

Links to additional information about this issue are provided in the overview and shown below:

http://www.maxim-ic.com/TechSupport/QA/Reliability/SumitomoNote.pdf

http://www.loctite.com/int_henkel/loctite/binarydata/pdf/elec_GreenMoldComp.pdf

 
 
Related Project(s):
EPAC (Electronic Packaging)
EPAR (Electronic Parts)
 
Related Area(s) of Emphasis:
Newly Available Technologies and COTS

 
Privacy Policy and Important Notices NEPP Help for Site Navigation NEPP Feedback Form Link to the NEPP Site Map
USA.gov  
NASA Logo - Click to visit the NASA Agency Website
NEPP Program Manager: Michael J. Sampson
Responsible NASA Official: Michael J. Sampson
Webmaster: Carl M. Szabo, Jr.
      Last Updated: November 29, 2007