+ View the NASA Portal NEPP Website Search   Powered By Google Your Path: Home » Parts » Parts Experts   Parts Publications Index   Parts Publications by Area of Emphasis   Parts Links Parts Experts   Parts Manufacturers   Focused Parts Issue Portals & NPSL   GSFC Parts Engineering Resources and Contacts   GSFC Specifications and Qualified Parts List Directory   Search         BACK to Publication List Solder Reflow Failures in Electronic Components during Manual Soldering File Name: Solder reflow.pdf | Date Submitted: 03/27/08   File Size: 1777KB Document Author Alexander Teverovsky - ateverov@pop300.gsfc.nasa.gov GSFC on-site Contractor Phone: 301 286-9691 | FAX: None On File [Additional User Information] Download "Solder Reflow Failures in Electronic Components during Manual Soldering" (1777KB) Now.   Description: presentation at CMSE'08   Abstract:   Related Project(s): General Technology EPAR (Electronic Parts)   Related Area(s) of Emphasis: High Density Packaging Technologies Advanced Interconnect Reliability     NEPP Program Manager: Michael J. Sampson Responsible NASA Official: Michael J. Sampson Webmaster: Carl M. Szabo, Jr.       Last Updated: November 29, 2007