Description:
Delaminations, electrical characteristics, and failures revealed during stress testing of these parts have been analyzed.
Abstract:
Reliability evaluation was performed on seven groups of different linear PEMs, which were rejected by C-mode scanning acoustic microscopy (C-SAM) examination during screening of parts for space applications.
The parts had excessive delaminations at one or more of the critical areas: paddle-to-molding compound (MC), die surface-to-MC, and lead-to-MC interfaces. These parts were subjected to solder reflow simulation and to environmental stress testing, including HAST at 130 oC/85% RH and various temperature cycling (1000 TC from –55 oC to 125 oC, 300 TC from 0 oC to 180 oC, and 300 cycles from 20 oC to 200 oC). Electrical measurements and C-SAM examinations were performed after each of the stress testing.
Evolution of delaminations, evolution of electrical characteristics, and failures revealed during stress testing of these parts have been analyzed. The observed results allow for refinement of the criteria for rejectable delaminations. The value of C-SAM as a screening procedure is discussed.
Related Project(s):
EPAC (Electronic Packaging)
EPAR (Electronic Parts)
Related Area(s) of Emphasis:
Newly Available Technologies and COTS
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