A variety of newly available plastic components in different packages will be subjected to high temperature aging, temperature cycling and surface mount reflow simulations.  These components will be selected from the list of parts used in NASA Projects.  After aging and/or stressing, the components will be tested for performance and CSAM examination to determine wire bonding integrity and degradation of the plastic/assembly interface.  This evaluation will provide NASA system designers with understanding of thermo-mechanical robustness of plastic packaged devices.  The test data generated will provide guidelines in review/optimization of screening techniques, and  predicting performance of the COTS component encapsulated in plastics that are intended for space applications.