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Environmental Hysteresis in Moulding Compounds and Volt Reference PEMs: Presentation
File Name: Environmental hysteresis Teverovsky.ppt | Date Submitted: 02/20/03
 

File Size:
2703KB
Document Author
Alexander Teverovsky - ateverov@pop300.gsfc.nasa.gov
GSFC on-site Contractor
Phone: 301 286-9691 | FAX: None On File
[Additional User Information]

Download "Environmental Hysteresis in Moulding Compounds and Volt Reference PEMs: Presentation" (2703KB) Now.
 
Description:
slide presentation at CMSE 2003
 
Abstract:
Characteristics of high precision linear devices (voltage reference devices, operational amplifiers, AD and DA converters) are known to be sensitive to mechanical stresses created by plastic packaging. Due to moisture swelling and creep in polymers, exposure of plastic encapsulated microcircuits (PEMs) to different environmental conditions can create additional strain in silicon chips causing parametric shifts and failures of sensitive devices. Temperature hysteresis caused by exposure to high or low temperatures is a known effect in linear PEMs. However details of this phenomenon, its temperature dependence and the rate of relaxation have not been addressed properly in the literature. Swelling or hygrothermal expansion of molding compounds in humid environments is another known, but still underestimated effect, which might cause instabilities in linear PEMs. The reverse process, namely, shrinkage of a plastic package, can be expected in vacuum conditions. This effect might change characteristics of PEMs with time and therefore cause errors in systems designed for space applications. These effects and their physical mechanisms have not been adequately investigated, in particular, as applicable to linear microcircuits. In this paper characteristics of several types of voltage reference PEMs have been evaluated before and after different environmental stress conditions including exposure to low and high temperatures, high temperature and humidity, vacuum and external mechanical stresses. Experiments showed that stresses which PEMs are typically subjected to during testing and screening for high reliability applications result in significant parametric shifts large enough to cause failures in sensitive systems with resolution of 12 bits and higher. Along with electrical testing, deformations of several types of PEMs caused by moisture sorption and high/low temperature excursions were evaluated using a hygroscopic weighting technique. Physical mechanisms of deformation in plastic packages and their relation to parametric shifts in different types of voltage reference PEMs are discussed. The obtained results indicate the presence in linear PEMs of a phenomenon which is more broad then just temperature hysteresis. A substantial parametric shift in similar devices might be caused by changes in environmental conditions and should be taken into account when sensitive electronic systems are designed for space and military high reliability applications.
 
Related Project(s):
EPAC (Electronic Packaging)
EPAR (Electronic Parts)
 
Related Area(s) of Emphasis:

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