Abstract:
The use of Micro Computed Tomography or "micro-CT" for non-destructive electronic part analysis is proposed. Micro CT is X-ray imaging in three dimensions. This the same method used in hospital CT (or "CAT") scans, but on a small scale. Increased resolution is possible as a result, on the order of 2-3 microns. Very fine scale internal structure of objects can now be imaged non-destructively. No sample preparation, staining, slicing, etc. are required.
A micro-focus x-ray source is used to illuminate the object. Planar x-ray detectors collect the magnified projection images. Hundreds of angular views are acquired as the object is rotated. A computer synthesizes a stack of virtual cross section slices through the object. Cross sections can then be interpolated along different planes, allowing inspection of the internal structure. Simple or complex volumes can be measured.
This task will examine applicability of this new technology for non-destructive part analysis. Micro CT images of discrete and VLSI parts (FPGAs, Flash) will be imaged before and after environmental stress.
The Micro CT tool is managed by JPL Section 322 (Planetary Science and Life Detection) and they will be co-investigators on this project.
Related Project(s):
EPAR (Electronic Parts)
Related Area(s) of Emphasis:
Advanced and Emerging Technologies
Development of Innovative Qualification Methods
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