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Task Plan - 04-048 Radiation Screening of Modern Packaged ICs (New task in FY04)
File Name: 04-048_GSFC_S-12-14_ Radiation screening packaged devices_01_29_04.ppt | Date Submitted: 08/29/03
 

File Size:
61KB
Document Author
Gary Swift - gary.swift@xilinx.com
No longer with registered organization
Phone: None on File | FAX: None On File
[Additional User Information]

Download "Task Plan - 04-048 Radiation Screening of Modern Packaged ICs (New task in FY04)" (61KB) Now.
 
Description:
Task Plan - FY04 Radiation Screening of Modern Packaged ICs (New task in FY04)
 
Abstract:
 
Modern ICs often present challenges for defining appropriate radiation testing parameters due to complexities involved with device packaging. Issues include die (sensitive volume) access and/or particle range for heavy ion single event testing, impact of package on total ionizing dose (TID) characteristics, PEMS/coating effects on linear devices, device thinning and radiation impacts, etc… This task is focused on defining the current state of knowledge, providing recommendations for qualification, and issuing a direction for future work in these areas.
 
Related Project(s):
EPAC (Electronic Packaging)
 
Related Area(s) of Emphasis:
Development of Innovative Qualification Methods

 
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