Abstract:
The JPL-led MicrotypeBGA Consortium of enterprises representing government agencies and private companies have jointed together to pool in-kind resources for developing the quality and reliability of chip scale packages (CSPs) for a variety of projects. In the process of building the Consortium CSP test vehicles, many challenges were identified regarding various aspects of technology implementation. This paper will present our experience in the areas of technology implementation challenges, including design and building both standard and microvia boards, and assembly of two types of test vehicles. We also discuss the most current package isothermal aging to 2,000 hours at 100°C and 125°C and thermal cycling test results to 1,700 cycles in the range of –30 to 100°C.
Related Project(s):
EPAC (Electronic Packaging)
Related Area(s) of Emphasis:
Substrates and Embedded Passives Technologies
High Density Packaging Technologies
Advanced Interconnect Reliability
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