Abstract:
Research and development of microelectromechanical systems (MEMS) has shown a significant promise for a variety of commercial applications. For example, accelerometers are widely used for air bag in automobile, MEMS inkjet print heads are used for printers, gyroscopes for guidance and navigation and pressure sensors for various industrial applications. Some of the MEMS devices have potential to become the commercial-off-the-shelf (COTS) components. Aerospace requires more sophisticated technology development to achieve significant cost savings if they could utilize COTS components in their systems. This paper provides an overview of the status of MEMS packaging technology and identifies a need for a systematic approach for this purpose.
Related Project(s):
EPAC (Electronic Packaging)
Related Area(s) of Emphasis:
Newly Available Technologies and COTS
MEMS/MOEMs Reliability Assurance
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