This task proposes to finish validation of a spark-plug type packaging module for high temperature silicon carbide (SiC) sensors and electronics. SiC has been established as a high temperature electronic and MEMS sensor material. Previously, NEPP supported successful validation of packaging sub-components for high temperature applications. The proposed activity includes integration of these packaging subcomponents to form a multi-purpose packaging module for SiC MEMS sensors with signal conditioning electronics followed by long term reliability validation and relevant aero-propulsion engine environment testing.  The high temperature sensors and electronics enable measurements of acoustic, temperature, pressure, and other physical parameters in high temperature environments, therefore benefiting missions to Venus, space and aero propulsion systems with active control, and launch vehicles.