The effect of standard non-reworkable underfill which was characterized by the JPL-led CSP Consortium was the subject of a recent editorial article published by Electronic News (WWW.electronicnews.com). Several quotes were reported from Dr. Ghaffarian, the author of this proposal. The title of the article was “To underfill or not to underfill, that is the question”. Whether 'tis nobler to encase solder connections with underfill or forgo this process step is a question increasingly being pondered by the great thinkers in assembly and packaging companies dealing with new chip-scale, flip-chip and other advanced [package] technologies. Such  packaging techniques are often threatened by thermal cycle failure or accidental breakage from shock and vibration, with underfill supposed to ward off such untimely fates.