Abstract:
Pure tin coatings grow whiskers, sometimes promptly, sometimes after a delay of several years. These have shorted electrical circuits, introducing anomalies and even failures. The risk of anomalies and failures is increasing as the typical bus voltages and available currents decreases. Also, spacecraft are subject to the occurance of a whisker-induced vacuum metal arc which sustains hundreds of amperes, until there is fatal damage. Finally, operation at temperatures below about 20 °C allows the transformation of tin from its metallic phase into a semiconducting phase that is both brittle and relatively non-conducting.
Related Project(s):
EPAC (Electronic Packaging)
Related Area(s) of Emphasis:
Lead Free Electronics
Development of Innovative Qualification Methods