+ View the NASA Portal NEPP Website Search   Powered By Google Your Path: Home » Packaging » Packaging Experts   Packaging Publications Index   Packaging Publications By Area of Emphasis   Packaging Links Packaging Experts   Focused Packaging Issues Portals   Search         Mrs. Jong Kadesch [PACKAGING ENGINEER] Contact Information: jkadesch@orbital.com Organization/Employer: Orbital http://www.orbital.com 7500 Greenway Center Dr. Suite 700 Greenbelt, Maryland 20770 301-220-5600 Authored Publications: 1. Processes for Utilizing Laser Machined Metallized Polyimide for Electronic Circuit Applications   Task Deliverable | File Size: 243KB | File Date: 2. Technology Readiness overview: Pb-Free Solder Alloy Investigation   Task Deliverable | File Size: 15039KB | File Date: 3. Reliability of Lead (Pb)-Free Solder Alloy   Presentation | File Size: 3983KB | File Date: 10/15/02 4. Effect of Conformal Coat on Tin Whisker Growth   Whitepaper | File Size: 1397KB | File Date: 9/1/00 5. Evaluation of the Die Attachment, Ablestik 84-1, for its Reliability for TDRS, September 1998   Evaluation Report | File Size: 2418KB | File Date: 9/1/98 6. Reworkability of Underfill Materials - 4th Quarter Report   Task Deliverable | File Size: 256KB | File Date: 10/10/01 7. Plastic Encapsulated Microcircuit (PEM) Guidelines for Screening and Qualification for Space   PEMs Guidelines | File Size: 194KB | File Date: 1/3/97 This User is a member of the NEPP Experts List Area(s) Of Expertise: Lead Free Electronics   NEPP Program Manager: Michael J. Sampson Responsible NASA Official: Michael J. Sampson Webmaster: Carl M. Szabo, Jr.       Last Updated: January 10, 2002