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Intermetallic Issues with Wire Joining by Thermocompression and Soldering
File Name: WEBEX Leidecker 1003 Au-Al intermet.ppt | Date Submitted: 03/11/05
 

File Size:
1661KB
Document Author
Henning Leidecker - henning.w.leidecker@nasa.gov
Goddard Space Flight Center
Phone: 301 286-9180 | FAX: 301 286-1695
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Description:
 
Abstract:
 
Related Project(s):
EPAC (Electronic Packaging)
 
Related Area(s) of Emphasis:
Advanced Interconnect Reliability

 
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