Task Plan - Reliability Assessment of Embedded Passives for Spaceborne Electronics
File Name: Reliability Assessment of Embedded Passives for Spaceborne Electronics.doc | Date Submitted: 03/13/02
Description:
Reliability Assessment of Embedded Passives for Spaceborne Electronics
Abstract:
Evaluate electrical performance of stacked, embedded capacitors and resistors on PASM Phase I substrate fabricated by Integral Wave Technologies, Inc., (IWT) before and after environmental stress, in particular humidity, and before and after flip-chip die attach.
Implement non-destructive evaluation (NDE) methods to evaluate the integrity of the flip-chip interconnection before and after environmental stress.
Evaluate embedded capacitors and resistors on PASM Phase II substrate under standard and operating electrical conditions.
Design and fabricate printed wiring board (PWB) incorporating Ohmega-Ply ™.
Evaluate electrical performance of PWB incorporating Ohmega-Ply ™ before and after environmental stress.
Implement non-destructive evaluation (NDE) methods to evaluate the integrity of the PWB with Ohmega-Ply ™ before and after environmental stress.
Related Project(s):
EPAC (Electronic Packaging)
Related Area(s) of Emphasis:
Substrates and Embedded Passives Technologies
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