Link to NASA Agency Website
NASA-NEPP Logo - Click to return to the NEPP Home Page    + View the NASA Portal
NEPP Website Search  
Powered By Google
Link to the NEPAG Home Page Link to the Photonics Page Link to the NEPP Parts Page Link to the NEPP Packaging Page Link to the NEPP Radiation Page Link to the DC/DC Converters Page Link to the NASA Parts Selection List
Link to the NASA Technical Standards Server Link to the NASA Workmanship Website Link to the Wirebond Website Link to the Tin Whiskers Home Page Link to the Plastic Encapsulated Microcircuits Page Link to the NEPP Publications Search Link to the NEPP Experts Page Link to the NEPP Calendar
Your Path: Home » Packaging » Packaging Experts
  Packaging Publications Index
  Packaging Publications By Area of Emphasis
  Packaging Links
Packaging Experts
  Focused Packaging Issues Portals
  Search
 
 
 
 
BACK to Publication List

Snapstrate and Socket for Chip-on-Board Programmable Technologies, September 1998
File Name: snapstrate.pdf | Date Submitted: 09/17/01
 

File Size:
291KB
Document Author
Jeannette Plante - jfplante@pop500.gsfc.nasa.gov
Goddard Space Flight Center
Phone: None on File | FAX: None On File
[Additional User Information]

Download "Snapstrate and Socket for Chip-on-Board Programmable Technologies, September 1998" (291KB) Now.
 
Description:
EPAC FY98
 
Abstract:

The use of bare dice on flight hardware enables designers to use the most advanced integrated circuit (IC) technologies in the smallest possible footprint. The only way to get the dice affordably is to buy them the way industry does-as untested material. This requires designers of high reliability hardware to find inexpensive, quick turn-around, and straightforward strategies for testing the dice and assembling them onto boards. Having known good dice is especially important for complex designs or expensive parts, with high numbers of interconnections where rework would be expensive. It is even more important when the part requires programming at the field level.

In the drive to exploit the benefits of using bare dice, a method for testing the dice prior to their integration into flight hardware is required. The Snapstrate was designed to provide a cost-effective vehicle for testing bare dice and producing Known Good Die.

 
Related Project(s):
EPAC (Electronic Packaging)
 
Related Area(s) of Emphasis:
High Density Packaging Technologies
Advanced Interconnect Reliability

 
Privacy Policy and Important Notices NEPP Help for Site Navigation NEPP Feedback Form Link to the NEPP Site Map
USA.gov  
NASA Logo - Click to visit the NASA Agency Website
NEPP Program Manager: Michael J. Sampson
Responsible NASA Official: Michael J. Sampson
Webmaster: Carl M. Szabo, Jr.
      Last Updated: January 10, 2002