+ View the NASA Portal NEPP Website Search   Powered By Google Your Path: Home » Packaging » Packaging Experts   Packaging Publications Index   Packaging Publications By Area of Emphasis   Packaging Links Packaging Experts   Focused Packaging Issues Portals   Search         BACK to Publication List Technology Readiness overview: Pb-Free Solder Alloy Investigation File Name: Pb Free (HTML) Version.doc | Date Submitted: 05/20/03   File Size: 15039KB Document Author Jong Kadesch - jkadesch@orbital.com Orbital Phone: None on File | FAX: None On File [Additional User Information] Download "Technology Readiness overview: Pb-Free Solder Alloy Investigation" (15039KB) Now.   Description:   Abstract:   Related Project(s): EPAC (Electronic Packaging)   Related Area(s) of Emphasis: Technology Readiness Overview Lead Free Electronics Newly Available Technologies and COTS     NEPP Program Manager: Michael J. Sampson Responsible NASA Official: Michael J. Sampson Webmaster: Carl M. Szabo, Jr.       Last Updated: January 10, 2002