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Task Plan - 06-286 Power MOSFETs - Reliability
File Name: 06-286 Task Plan PowerMosfets FY06.A.pdf | Date Submitted: 09/12/05

File Size:
93KB

Document Author

Robert (David) Gerke - David.Gerke@jpl.nasa.gov
Jet Propulsion Laboratory
Phone: 818 393-6372 | FAX: 818 393-4382

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Download "Task Plan - 06-286 Power MOSFETs - Reliability" (93KB) Now.

Description:

Abstract:

New package types such as CopperStrap(TM), PowerPak(TM) and DirectFET(TM) can potentially reduce the DFPR from 1.5 mOhm in the standard SO-8 package to only 0.1 mOhm in the same foot-print and reduce the thermal resistance to 3 degrees C/W compared to 18 degrees C/W for the SO-8 package. An evaluation of these packages will be performed.

Related Project(s):
EPAR (Electronic Parts)

Related Area(s) of Emphasis:
Advanced and Emerging Technologies
Advanced Interconnect Reliability

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			Last Updated: January 10, 2002