+ View the NASA Portal NEPP Website Search   Powered By Google Your Path: Home » Packaging » Packaging Experts   Packaging Publications Index   Packaging Publications By Area of Emphasis   Packaging Links Packaging Experts   Focused Packaging Issues Portals   Search         BACK to Publication List Technology Readiness Overview: Ball Grid Array and Chip Scale Packaging File Name: Technology Readiness Overview BGA and CSP.pdf | Date Submitted: 01/23/03   File Size: 350KB Document Author Reza Ghaffarian - Reza.Ghaffarian@jpl.nasa.gov Jet Propulsion Laboratory Phone: 818 354-2059 | FAX: 818 393-5245 [Additional User Information] Download "Technology Readiness Overview: Ball Grid Array and Chip Scale Packaging" (350KB) Now.   Description:   Abstract:   Related Project(s): EPAC (Electronic Packaging)   Related Area(s) of Emphasis: Technology Readiness Overview High Density Packaging Technologies Advanced Interconnect Reliability     NEPP Program Manager: Michael J. Sampson Responsible NASA Official: Michael J. Sampson Webmaster: Carl M. Szabo, Jr.       Last Updated: January 10, 2002