+ View the NASA Portal NEPP Website Search   Powered By Google Your Path: Home » Packaging » Packaging Experts   Packaging Publications Index   Packaging Publications By Area of Emphasis   Packaging Links Packaging Experts   Focused Packaging Issues Portals   Search         BACK to Publication List Reliability of Lead (Pb)-Free Solder Alloy File Name: Pb-free on HVP_final_FY02.ppt | Date Submitted: 11/05/02   File Size: 3983KB Document Author Jong Kadesch - jkadesch@orbital.com Orbital Phone: None on File | FAX: None On File [Additional User Information] Download "Reliability of Lead (Pb)-Free Solder Alloy" (3983KB) Now.   Description: Sn/Ag, Pb-free, Hand soldering   Abstract: The task is to evaluate various Pb-free candidate solder alloys for space application.  The evaluation includes component solderability with different lead-free solder alloys, investigation of fluxes, various component lead finish and PWB finish.  This year task is to validate the soldering process using Pb-free solder alloys.  GSFC is conducting the evaluation of soldering process using hand-soldering and JPL is evaluating surface mount technology (SMT) soldering process.  The assembled test boards will be subjected to thermal cycles to failure to obtain solder joint reliability data during FY03.   Related Project(s): EPAC (Electronic Packaging)   Related Area(s) of Emphasis: Lead Free Electronics Advanced Interconnect Reliability     NEPP Program Manager: Michael J. Sampson Responsible NASA Official: Michael J. Sampson Webmaster: Carl M. Szabo, Jr.       Last Updated: January 10, 2002