+ View the NASA Portal NEPP Website Search   Powered By Google Your Path: Home » Packaging » Packaging Experts   Packaging Publications Index   Packaging Publications By Area of Emphasis   Packaging Links Packaging Experts   Focused Packaging Issues Portals   Search         BACK to Publication List Task Plan - 05-013A Extreme Environments: Cold/Hot Reliability File Name: Task Plan 05-A013 Extreme Environments Hot Cold Rel.doc | Date Submitted: 02/07/05   File Size: 25KB Document Author Reza Ghaffarian - Reza.Ghaffarian@jpl.nasa.gov Jet Propulsion Laboratory Phone: 818 354-2059 | FAX: 818 393-5245 [Additional User Information] Download "Task Plan - 05-013A Extreme Environments: Cold/Hot Reliability" (25KB) Now.   Description:   Abstract:   Related Project(s): EPAC (Electronic Packaging)   Related Area(s) of Emphasis: System on a chip (SOC) and System in a package (SIAP) Reliability Extreme Environment Electronics and Packaging     NEPP Program Manager: Michael J. Sampson Responsible NASA Official: Michael J. Sampson Webmaster: Carl M. Szabo, Jr.       Last Updated: January 10, 2002